Technological watch

Organic Semiconductor–DNA Hybrid Assemblies

By virtue of the active role of DNAs, even conventional organic molecules widely used in organic light?emitting diodes can become bioactive and generate biospecific photonics. The fabrication of emerging hybrid assemblies of DNAs complexed with various organic semiconductors is described, together with their applications in the field of biophotonic electronics resulting from their endowed biofunctions.Organic semiconductors are photonic and electronic materials with high luminescence, quantum efficiency, color tunability, and size?dependent optoelectronic properties. The self?assembly of organic molecules enables the establishment of a fabrication technique for organic micro? and nano?architectures with well?defined shapes, tunable sizes, and defect?free structures. DNAs, a class of biomacromolecules, have recently been used as an engineering material capable of intricate nanoscale structuring while simultaneously storing biological genetic information. Here, the up?to?date research on hybrid materials made from organic semiconductors and DNAs is presented. The trends in photonic and electronic phenomena discovered in DNA?functionalized and DNA?driven organic semiconductor hybrids, comprising small molecules and polymers, are observed. Various hybrid forms of solutions, arrayed chips, nanowires, and crystalline particles are discussed, focusing on the role of DNA in the hybrids. Furthermore, the recent technical advances achieved in the integration of DNAs in light?emitting devices, transistors, waveguides, sensors, and biological assays are presented. DNAs not only serve as a recognizing element in organic?semiconductor?based sensors, but also as an active charge?control material in high?performance optoelectronic devices.

Publication date: 09/10/2020

Author: Chunzhi Cui, Dong Hyuk Park, Dong June Ahn

Reference: doi:10.1002/adma.202002213

Advanced Materials


This project has received funding from the European Union’s Horizon 2020 research and innovation programme under grant agreement No 870292.